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HRL Receives Patent for "Thermal Management Substrate"

MALIBU, Calif., April 13, 2010—HRL received an important patent from the United States Patent Office titled "Thermal Management Substrate." This invention describes a method that would enable the fabrication of silicon-based integrated circuits on a diamond substrate, which has significantly better thermal properties than silicon. The method offers the potential to resolve heating issues that presently affect high-performance integrated circuits ranging from computer chips to power converters. 

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HRL Laboratories, LLC, Malibu, California (www.hrl.com) is a corporate research-and-development laboratory owned by The Boeing Company and General Motors specializing in research into sensors and materials, information and systems sciences, applied electromagnetics, and microelectronics. HRL provides custom research and development and performs additional R&D contract services for its LLC member companies, the U.S. government, and other commercial companies.

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