HRL Laboratories, LLC, is advancing its cutting-edge 3D-printed metals technology, extending an ever-widening portfolio of innovation in additive manufacturing with its 19th patent stemming from the revolutionary technology. HRL’s patent portfolio in this area extends back to 2014 with the early development of the process that would come to be known as functionalization.

HRL Laboratories, LLC, will further its maturation of gallium nitride (GaN) semiconductor fabrication with a new award as part of the US Navy’s SOTA Radio Frequency Gallium Nitride “STARRY NITE” program. The $24M program is administered by the Naval Surface Warfare Center Crane Division and the National Security Technology Accelerator (NSTXL). The program will enable HRL to advance the manufacturing readiness level of its 40nm node T3 GaN process.

HRL Laboratories has launched Artificial Intelligence Opponents for Contested Space, a project to create an AI program to help train operators who may be required to control and monitor craft in future contested outer space operations.

HRL Laboratories staff scientist Brett reveals his favorite aspects of doing research at HRL, and how smoothly he could transition from intern to full-time employee with encouragement from his HRL colleagues.

Meet our DEI Specialist, Tess, who talks about a few of the highlights HRL Laboratories has to offer.

Nina, a research engineer at HRL Laboratories, gives an inside view on beginning her professional career in HRL’s Sensors and Electronics Lab while navigating our unusual current social environment.

Katya Stonkevitch presents Additive Manufacturing of Polymer-Derived Ceramic Matrix Composites for AAAFM-UCLA 2021.

HRL Laboratories, LLC, is pleased to announce that Hunter Martin has been appointed as the new Director of HRL’s Center for Additive Materials (CAM). Hunter has been involved in advanced material development for over 10 years and currently leads multiple programs on new alloy and application development in additive manufacturing.

HRL Laboratories, LLC’s additive manufacturing team has demonstrated 3D-printed polymer interposers with previously impossible slanted and curved vias with diameters of less than 10µm. Vias are small openings in the insulating layers of integrated circuits that allow conductive connections between semiconductor layers.

HRL Laboratories, LLC, announced that Aruna Jammalamadaka, a research staff scientist in HRL’s Information and Systems Sciences Lab, was the latest HRL researcher to join other early-career engineers selected to take part in the National Academy of Engineering’s 26th Annual US Frontiers of Engineering Symposium, this year conducted virtually.