HRL announced the successful results of research initiated and supported by Microsoft Research to create a prototype curved-sensor camera that surpasses the sharpness performance of larger professional camera systems, improving image uniformity and illumination.
HRL has received an award from DARPA to develop and demonstrate high-efficiency MMICs for RF bands in the 50 to 110-GHz frequency range.
HRL has received an award from the NGA through a competitive bid under their BIG program to research artificial intelligence capabilities, specifically the SLICK-AVA project.
HRL Laboratories, LLC has been awarded $654,965 by the Office of the Director of National Intelligence under Intelligence Advanced Research Projects Activity (IARPA) to study security of stored biometric data.
HRL Laboratories, LLC, was represented at the 3rd Annual Brain Initiative Investigators meeting by Dr. Praveen Pilly, who presented Improving Memory Performance by Augmenting Consolidation with Transcranial Stimulation in the plenary session on “Applications of BRAIN Technologies”.
HRL Laboratories, LLC has received an award from the Defense Advanced Research Project Agency (DARPA) under its Diverse Accessible Heterogeneous Integration (DAHI) program to develop a novel multichip integration technology using HRL’s Metal Embedded Chip Assembly (MECA) process.
HRL researchers originally made headlines with a famous image of a metal microlattice structure resting atop an unaffected dandelion. Now the material has been vetted and confirmed by the Guinness book as having no peer among metals when it comes to weight.
The Defense Advanced Research Projects Agency (DARPA) has awarded HRL Laboratories, LLC, $ 1.5 million to develop an ultra-low power oven controlled crystal oscillator (OCXO) for use as a frequency reference for new high-performance, low-power atomic clocks.
The Defense Advanced Research Projects Agency (DARPA) has awarded HRL Laboratories, LLC, funding to research novel ways to synthesize semiconductors for sensing in the infrared spectrum, and methodologies to cost effectively integrate the infrared materials with silicon read-out integrated circuits (ROIC).