Displaying news tagged: cooling
HRL to Present Superior Cooling System for Stacks of Computer Chips at GOMACtech
MALIBU, Calif. March 12, 2025—HRL Laboratories plans to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with a novel cooling system for stacks of microelectronic chips. The program, called PHased ARray with INnovative HEterogeneously Integrated Thermal Solution (PHARINHEITS), aims to create compact thermal management technology in a chip stack …
Continue reading “HRL to Present Superior Cooling System for Stacks of Computer Chips at GOMACtech”