Displaying news tagged: next-generation
HRL to Present Superior Cooling System for Stacks of Computer Chips at GOMACtech
MALIBU, Calif. March 12, 2025—HRL Laboratories plans to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with a novel cooling system for stacks of microelectronic chips. The program, called PHased ARray with INnovative HEterogeneously Integrated Thermal Solution (PHARINHEITS), aims to create compact thermal management technology in a chip stack …
Continue reading “HRL to Present Superior Cooling System for Stacks of Computer Chips at GOMACtech”
HRL Project Will Keep Data Cool with Far Less Energy
New Award Under ARPA-E COOLERCHIPS Program Aimed at Extremely Efficient Thermal Management for Next-Generation Data Centers to Reduce Carbon Emissions, Mitigate Climate Change