Displaying news tagged: next-generation

MALIBU, Calif. March 12, 2025—HRL Laboratories plans to surpass heat transfer metrics set out by the Defense Advanced Research Project Agency (DARPA) with a novel cooling system for stacks of microelectronic chips. The program, called PHased ARray with INnovative HEterogeneously Integrated Thermal Solution (PHARINHEITS), aims to create compact thermal management technology in a chip stack …

Continue reading “HRL to Present Superior Cooling System for Stacks of Computer Chips at GOMACtech”

New Award Under ARPA-E COOLERCHIPS Program Aimed at Extremely Efficient Thermal Management for Next-Generation Data Centers to Reduce Carbon Emissions, Mitigate Climate Change